IBM the computer maker are now in the process of developing the new product called “skyscrapers” in which they are using silicon of chips which is placed layer after layers of chips by a very small components together, so they are ready in developing the next generations of computers and Smartphone which will be processing 1000 times faster than the system that we are using now-a-days, the IBM has joined with glue maker 3M for the process they are very eager to sale it in the market as earlier by the year 2013.
This is not just any glue. It’s an adhesive that dissipates heat so efficiently that layer upon layer of chips can be stacked on top of each other into silicon “towers” up to 100 layers high, glued together with this special adhesive that keeps things cool. The result? Faster chips for computers, laptops, smartphones and anything else that uses microprocessors.
Mike Bowman, marketing manager for 3M, said: “This material fits underneath computer chips when they’re attached to printed circuit boards – the unique part of what we’re doing is that our glue conducts heat out to the edge of the sandwich. It will spread heat more evenly through the chip. With conventional chips, with just one or two layers, but once you’re stacking chips, the problem can become very severe.”
When can we get our hands on this breakthrough tech? IBM’s media relations representative Michael Corrado tells, “By the end of 2013 it should go into production. It’ll show up on servers first, and then a year after that consumer might see it.”
Watch the video after the break, illustrating this exciting new breakthrough (no sound):